Semiconductors & Chipsets VMR-SC-2024-002 Published October 2024

Advanced Semiconductor Packaging: Competitive Intelligence Briefing

Chiplet architectures, 3D stacking economics, and the battle for next-gen compute density.

210 pages
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Executive Abstract

Covers TSMC CoWoS, Intel Foveros, Samsung I-Cube4 economics. Includes 14 proprietary teardown analyses and a 5-year wafer cost model with sensitivity analysis.

Research Methodology

Proprietary teardown analysis of 14 advanced-packaged devices. Wafer cost modeling using process node economics and yield assumptions. Expert interviews with 28 semiconductor process engineers.

Table of Contents

01 Executive Summary Preview
02 CoWoS vs Foveros vs I-Cube4 Preview
03 Teardown Analyses (14 Devices)
04 Wafer Cost Model
05 Hybrid Bonding Roadmap
06 Supply Chain Risk Assessment
07 5-Year Market Forecast
08 Appendix

Lead Analyst

JW

James Whitfield

Ex-Intel Fellow, 22 years in semiconductor process engineering. BS/MS Stanford EE.

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